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Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Termal İletkenlik Pedi, çok iyi çalışıyor ve çalışıyor. Artık diğer Termal İletken Pad'e ihtiyacımız yok!

—— Peter Goolsby

2 yıldır Ziitek ile işbirliği yaptım, yüksek kaliteli termal iletken malzemeler sağladılar ve zamanında teslim ettiler, faz değişim malzemelerini tavsiye ettiler

—— Antonello Sau

Kaliteli, iyi hizmet. Ekibiniz bize her zaman yardım eder ve çözer, her zaman iyi bir partner olacağımızı umarız!

—— Chris Rogers

Ben sohbet şimdi

Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Büyük resim :  Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Ürün ayrıntıları:
Menşe yeri: Çin
Marka adı: ZIITEK
Sertifika: UL and RoHs
Model numarası: TIF100-50-11US
Ödeme & teslimat koşulları:
Min sipariş miktarı: 1000 adet
Fiyat: Anlaşılabilir
Ambalaj bilgileri: 1000 adet/torba
Teslim süresi: 3-5 iş günü
Ödeme koşulları: T/T
Yetenek temini: 100000 pc/gün
Detaylı ürün tanımı
Ürün adı: Yapay Zeka İşlemciler Yapay Zeka Sunucuları Akıllı Ev Telekom için Silikon Bazlı Gap Pad Dolgu Yumuş Başvuru: Yapay Zeka İşlemciler, Yapay Zeka Sunucuları, Akıllı Ev, Telekom
Önerilen Çalışma Sıcaklığı: -40 ila 200 ℃ Isı iletkenliği: 5,0 W/m-K
Sertlik: 65/20 Sahil 00 Yoğunluk: 3,2 gr/cm³
Renk: koyu gri Kalınlık: 0,010"(0,25mm)~0,200"(5,0mm)
Anahtar Kelimeler: termal boşluk pedi

Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

 

The TIF®100-50-11US Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.

 

Features


> Good thermal conductive: 5.0W/mK 
> Moldability for complex parts
>
Easy release construction
> Electrically isolating
> High durability


Applications


Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®100-50-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0W/m-K ASTM D5470
5.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

İletişim bilgileri
Dongguan Ziitek Electronic Materials & Technology Ltd.

İlgili kişi: Dana Dai

Tel: 18153789196

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