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Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Termal İletkenlik Pedi, çok iyi çalışıyor ve çalışıyor. Artık diğer Termal İletken Pad'e ihtiyacımız yok!

—— Peter Goolsby

2 yıldır Ziitek ile işbirliği yaptım, yüksek kaliteli termal iletken malzemeler sağladılar ve zamanında teslim ettiler, faz değişim malzemelerini tavsiye ettiler

—— Antonello Sau

Kaliteli, iyi hizmet. Ekibiniz bize her zaman yardım eder ve çözer, her zaman iyi bir partner olacağımızı umarız!

—— Chris Rogers

Ben sohbet şimdi

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Büyük resim :  Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Ürün ayrıntıları:
Menşe yeri: Çin
Marka adı: ZIITEK
Sertifika: UL and RoHs
Model numarası: TIF100-40-11US
Ödeme & teslimat koşulları:
Min sipariş miktarı: 1000 adet
Fiyat: Anlaşılabilir
Ambalaj bilgileri: 1000 adet/torba
Teslim süresi: 3-5 iş günü
Ödeme koşulları: T/T
Yetenek temini: 100000 pc/gün
Detaylı ürün tanımı
Ürün adı: Elektronik Bileşenler İçin İyi Isı İletkenliği Silikon Bazlı Termal Boşluk Pedi 5G Havacılık AI Başvuru: Elektronik Bileşenler 5G Havacılık ve Uzay Yapay Zekası
Kalınlık: 0,010"(0,25mm)~0,200"(5,0mm) Isı iletkenliği: 4,0 W/mK
Anahtar Kelimeler: termal boşluk pedi Sertlik: 65/20 Sahil 00
Yoğunluk: 3,2 gr/cm³ Renk: koyu gri
Önerilen Çalışma Sıcaklığı: -40 ila 200 ℃

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

 

The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


> Good thermal conductive: 4.0W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

 


Applications


> Cpu heat sinking 
> High speed mass storage drives
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

 

 

Typical Properties of TIF®100-40-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0W/m-K ASTM D5470
4.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

İletişim bilgileri
Dongguan Ziitek Electronic Materials & Technology Ltd.

İlgili kişi: Dana Dai

Tel: 18153789196

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