logo
Ana sayfa ÜrünlerTermal İletken Pad

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Termal İletkenlik Pedi, çok iyi çalışıyor ve çalışıyor. Artık diğer Termal İletken Pad'e ihtiyacımız yok!

—— Peter Goolsby

2 yıldır Ziitek ile işbirliği yaptım, yüksek kaliteli termal iletken malzemeler sağladılar ve zamanında teslim ettiler, faz değişim malzemelerini tavsiye ettiler

—— Antonello Sau

Kaliteli, iyi hizmet. Ekibiniz bize her zaman yardım eder ve çözer, her zaman iyi bir partner olacağımızı umarız!

—— Chris Rogers

Ben sohbet şimdi

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Büyük resim :  Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Ürün ayrıntıları:
Menşe yeri: Çin
Marka adı: ZIITEK
Sertifika: UL and RoHs
Model numarası: TIF100-50-11U
Ödeme & teslimat koşulları:
Min sipariş miktarı: 1000 adet
Fiyat: Anlaşılabilir
Ambalaj bilgileri: 1000 adet/torba
Teslim süresi: 3-5 iş günü
Ödeme koşulları: T/T
Yetenek temini: 100000 pc/gün
Detaylı ürün tanımı
Ürün adı: Yapay Zeka İşlemcileri Yapay Zeka Sunucuları İçin Silikon Bazlı Ultra Yumuşak Termal GAP PAD Malzeme Isı iletkenliği: 5,0 W/m-K
Anahtar Kelimeler: Termal GAP PAD Malzemeleri Alev Derecelendirmesi: UL 94 V-0
Başvuru: Yapay Zeka İşlemcileri Yapay Zeka Sunucuları Sertlik: 27 Shore 00
Sürekli Kullanım Sıcaklığı: -40 ila 200 ℃ Özgül Ağırlık: 3.4g/cc
Yapı: Seramik dolgulu silikon elastomer

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Application:


Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of The TIF®100-50-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

İletişim bilgileri
Dongguan Ziitek Electronic Materials & Technology Ltd.

İlgili kişi: Dana Dai

Tel: 18153789196

Sorgunuzu doğrudan bize gönderin (0 / 3000)

Diğer ürünler