logo
Ana sayfa ÜrünlerTermal İletken Pad

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Termal İletkenlik Pedi, çok iyi çalışıyor ve çalışıyor. Artık diğer Termal İletken Pad'e ihtiyacımız yok!

—— Peter Goolsby

2 yıldır Ziitek ile işbirliği yaptım, yüksek kaliteli termal iletken malzemeler sağladılar ve zamanında teslim ettiler, faz değişim malzemelerini tavsiye ettiler

—— Antonello Sau

Kaliteli, iyi hizmet. Ekibiniz bize her zaman yardım eder ve çözer, her zaman iyi bir partner olacağımızı umarız!

—— Chris Rogers

Ben sohbet şimdi

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Büyük resim :  Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Ürün ayrıntıları:
Menşe yeri: Çin
Marka adı: ZIITEK
Sertifika: UL and RoHs
Model numarası: TIF600P
Ödeme & teslimat koşulları:
Min sipariş miktarı: 1000 adet
Fiyat: Anlaşılabilir
Ambalaj bilgileri: 1000pcs/çanta
Teslim süresi: 3-5 gün
Yetenek temini: 100000 pc/gün
Detaylı ürün tanımı
Ürün adı: Yapay Zeka Sunucuları İçin Ultra Yüksek Termal İletkenlik Boşluk Doldurma Pedi Anahtar Kelimeler: termal boşluk dolgu pedi
Sertlik: 60 kıyı00 Dielektrik sabiti @1MHz: 4.5
Örnek: Örneksiz Renk: lal taşı
Isı İletkenliği: 6,0 W/mK Yoğunluk(g/cm³): 3.4
Uygulama: Yapay Zeka Sunucuları

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
 
Features:

> High thermal conductivity: 6.0W/mK

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> Broad range of hardnesses available

> Outstanding thermal performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Signal communication
>  New energy vehicle
>  Motherboard chip
>  Radiator

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

> SMD LED module
> LED Flesible strip, LED bar
> Routers
> Medical Devices

Typical Properties of TIF®600P Series
Property Value Test method
Color Garnet Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >4.2X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470

6.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

İletişim bilgileri
Dongguan Ziitek Electronic Materials & Technology Ltd.

İlgili kişi: Dana Dai

Tel: 18153789196

Sorgunuzu doğrudan bize gönderin (0 / 3000)

Diğer ürünler