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Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Sertifika
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
Çin Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikalar
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Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance
Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Büyük resim :  Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Ürün ayrıntıları:
Menşe yeri: ÇİN
Marka adı: ZIITEK
Sertifika: UL and RoHs
Model numarası: TIF100-10-01U Serisi
Belge: TIF100-10F_Data Sheet.pdf
Ödeme & teslimat koşulları:
Min sipariş miktarı: 1000 adet
Fiyat: Anlaşılabilir
Ambalaj bilgileri: 1000 adet/torba
Teslim süresi: 3-5 iş günü
Ödeme koşulları: T/T
Yetenek temini: 10000/gün

Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Açıklama
Ürün Adı: Elektronik Cihazlarda Isı Dağıtımı için Termal Yönetim ve Gelişmiş Performans Sağlayan Termal İletke Sürekli Kullanım Sıcaklığı: -40 ℃ -200 ℃
Yoğunluk: 2,1 g/cm³ Başvuru: Elektronik Cihazlarda Isı Yayılımı
Sertlik: 65/60 kıyı 00 Anahtar Kelimeler: Termal iletken Ped
Renk: gri Termal iletkenlik ve kompozisyon: 1,5 W/mK
Kalınlık: 0.010 ~ 0.20 inç / 0.25 ~ 5.0mmt Yapı: Seramik dolgulu silikon elastomer

Thermal Conductive Pad for Heat Dissipation in Electronic Devices
TIF®100-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation.
Key Features
  • Excellent thermal conductivity: 1.5W/mK
  • Good softness and fillability
  • Self-adhesive without additional surface adhesives
  • Good insulation performance
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED TV and lamps
  • Telecommunication hardware
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
Technical Specifications - TIF®100-10F Series
Property Value Test Method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.1 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0
ASTM D374
Hardness (Shroe 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
TIF®100-10F Series Thermal Conductive Pad product image
Packaging & Lead Time

Packaging Details:

  • PET film or foam protection
  • Paper card separation between layers
  • Export carton packaging (inside and outside)
  • Customized packaging available per customer requirements

Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated

Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for competitive markets. Our vast experience allows us to best assist customers in thermal engineering. We serve customers with customized products, full product lines, and flexible production, making us your best and most reliable partner. Let's make your design more perfect!
Certifications
  • ISO9001:2015
  • ISO14001:2004
  • IATF16949:2016
  • IECQ QC 080000:2017
  • UL Certified
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competency: Thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offerings
  • Quality assurance contracts

İletişim bilgileri
Dongguan Ziitek Electronic Materials & Technology Ltd.

İlgili kişi: Dana Dai

Tel: +86 18153789196

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